南宫国际

IGBT/ SiC module layered detection

Semiconductor chip packaging layered detection

Diamond thickness measurement and inter issue detection

Heat sink detection

Non-destructive testing with high efficiency

High scan speed and high resolution imaging

Multi-layer defect up to 1000 layers

Real-time display and analysis software for detection images

Customizable waterproof fixtures fordifferent products

Multiple channels （2 or 4 channels）are available