南宫国际


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    SAM Auto Wafer 304
    Application

    This line was specially developed for the inspection of wafers or bonded wafers (MEMS) to detect cavities, inclusions, or delamination in bonded layers.

    Features

    Loadport can be docked with standard Cassette

    Aligner wafer calibration, edge detection

    Dedicated wafer Robot for sampling, barcode reading, and sample placing in the sink

    Four probes collaborate for rapid wafer ultrasound detection

    Technical Parameter
    Application
    4” , 6”, 8”, 12”wafers
    Dimension
    2400x2000x1300㎜
    Transducers
    4 transducers, customizable
    Resolution
    1~4000 μm
    Bandwidth
    1-500 MHz
    Scanning Settings
    High precision scanning, fast scanning
    Platform
    Marble
    X/Y axis
    Linear motor, gantry double drive
    Max Scanning Speed
    2000mm/s
    Max acceleration
    2G/s
    Frequency
    Compatible with 1~300MHz
    Fixture
    Dedicated to wafer, customizable
    Auto Loading and unloading
    Customizable
    Samples
    Stock Name:

    南宫国际超声

    Stock Code:

    688392



    Sales hotline:400-888-0829
    After-sales hotline:400-888-3348
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